Semicon 2.0 - 7 Pillars
1. Chip Design → Compute, Memory, RF, Power, Networking, Sensors
2. Machines → Domestic semiconductor equipment manufacturing
3. Materials → Specialty chemicals, gases & materials
4. Fabs → Expand domestic fabrication capacity
5. Packaging → Focus on advanced packaging
6. Research → Move from existing 40 nm capability towards 7–3 nm advanced nodes over 8 years
7. Talent → Train 1 lakh design engineers
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3August 26, 2026 2.6K 18
