GlobalFoundries and TSMC Ink $2B Deal for US Interposer Production
The partnership addresses a major domestic supply chain bottleneck for advanced semiconductors used in AI datacenters.
• GlobalFoundries and TSMC announced a $2 billion partnership on Thursday to build silicon interposers in New York.
• GlobalFoundries will produce interposers for TSMC CoWoS advanced packaging at its Malta fab site.
• Volume production will begin in the first half of 2028 at the earliest under a five-year agreement.
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October 9, 2026 15
