Intel attracts MediaTek, Broadcom, and Meta for AI chip packaging… — Sammy Fans - Samsung, One UI 9, Galaxy Z Fold 8 Ultra — TG.ME

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Intel attracts MediaTek, Broadcom, and Meta for AI chip packaging amid TSMC shortage

While TSMC continues to expand its advanced packaging capacity, demand for its CoWoS technology remains so strong that customers are increasingly looking for alternatives.

https://www.sammyfans.com/2026/09/01/intel-attracts-mediatek-broadcom-and-meta-for-ai-chip-packaging-amid-tsmc-shortage/

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September 2, 2026 639